Process Engineer

Job Description

Basic Purpose of Position: Develops or improves manufacturing process for new or existing products. Performs advanced, long term and complex project management for the development, implementation and maintenance of surface mount and/or through hole printed circuit board assemblies. Applies lean manufacturing principles to improve production quality or decrease manufacturing costs.

Primary or Major Responsibilities:

• Develop, analyze and improve processes to increase efficiency of production, analyze root cause, generate reports and implement corrective or preventative actions
• Preview, introduce and review prototype and provide feedback to customer to increase manufacturability and efficiencies.
• Investigate, establish and implement requirements for equipment tooling, materials, and methods of manufacturing including make or buy decisions and facility layout as required for new or revised products from pilots through normal production
• Interface with appropriate internal department personnel to ensure process integrity
• Prepare and rework labor cost estimate and manufacturing cost reduction plans
• Provide technical expertise to production personnel
• Train supervisors and operators

Safety:

• Ensure that all assignments are performed in compliance with all applicable Federal, State, Provincial and Company safety and health regulations, and where applicable, proper personal protective equipment is utilized.

Minimum Requirements:

• BA/BS in chemistry, mechanical or industrial engineering and a minimum of five years related experience preferably in printed circuit assembly manufacturing or related degree with progressive experience in manufacturing or other job related experience deemed acceptable by the hiring team.
• Green/black belt certification desired
• Experience with advanced PCB technologies; strong in time and motion measurement of operations
• Due to ITAR requirements, US citizenship and security clearance required
• Ability to function effectively in a team environment
• Effective communication skills driven by attention to detail
• Strong DFM and NPI skills
• Excellent analytical skills using Six Sigma and Lean Principles
• Knowledge of quality assurance and control principles and practices
• Self motivated and self managed
• Additionally, some combination of the experience below may be required:
  • Experience with lead free materials and technologies
  • Experience with flex and rigid flex PCB assembly
  • Experience with high density interconnect technology
  • Experience with micro-via interconnect technology
  • Experience with hybrid construction materials
  • Experience with hand or robotic soldering technology experience with tooling and fixture design
  • Experience with Epoxies and RTV application and technology
  • Experience with methods of application of epoxies and RTV’s
  • Experience with acrylic conformal coatings
  • Experience with manual and automated application of conformal coatings
  • Experience with polyurethane conformal coating.

It is understood that certain minimum requirements are not tested for but monitored for competent capability during the employee’s indoctrination period.